Aka-Cure Slow 250 ml


Epoxy curing agent.
Slow cure schedule.

Viscosity: 20 cps at 25 °C.

Cures in 8-24 h at 22 °C.
Peak temperature is 40 °C in a 40 mm dia. mount.
For best results apply a post-cure at 100 °C for 1 h.

Long pot-life and low peak temperature makes it suitable for both impregnation and heat sensitive specimens.
It is recommended to use forced cooling in a fume hood with moulds larger than 40 mm dia. to avoid thermal runaway.

Mix exactly 12 g of Aka-Cure Slow with 100 g of Aka-Resin (alternatively, 13.5 ml/100 ml).

Click here for SDS/PDS.

Availability: In stock