Aka-Cure, Slow

Cures at room temperature, ideal for heat sensitive specimens

Aka-Cure, Slow has very good mechanical and chemical properties, although not as good as Aka-Cure, Quick. Then again it does not require an oven to cure it.

Cures between 8 and 24 hours @20°C.

Heat sensitive specimens

Some materials are heat sensitives and will recrystalize when exposed to high temperatures. Such specimens can be embedded without any risk using Aka-Cure, Slow.

Peak-temperature is as low as 40°C, with mounts of ø25 mm and ø30mm size.

Good edge retention and low shrinkage

Good edge retention and low shrinkage results in an embedding ease to prepare.

The finished embeddings are clear with a light yellow tone, no problems with identifying the embedded sample.

Impregnation

Long pot-life and low viscosity makes Aka-Cure, Slow very suitable for impregnation of porous specimens.

Technical data
Topic Data
¹After post-cure 2 hours @100°C. Data for curing Aka-Resin
Mixing ratio 13.0 g to 100 g
Pot life 20 min. 150 g mix @25°C
Linear shrinkage insignificant
Peak temperature Room temperature + 5°C @ø40 mm
Hardness 75 Shore D
Viscosity 450 - 550 mPa.s @25°C
sp. gr. 1.14 g/cm³ @25°C
Refractive index 1.57
Heat deflection temperature 50°C
Heat deflection temperature¹ 100°C